FSI analysis of wire sweep in encapsulation process of plastic ball grid array packaging

This paper presents the three-dimensional (3d) fluid-structure interaction (fsi) analysis of wire sweep during the encapsulation process of the plastic ball grid array (pbga) packaging. 3d model of the mold and wires are created using gambit,and the fluid/structure analysis is simulated using fluent and abaqus software which integrated with mesh based parallel code coupling interface (mpcci) in real time calculations. the castro-macosko model is used to describe the polymer rheology effects and volume of fluid (vof) method is applied for the flow front tracking. appropriate user-defined functions (udfs) are written to model the viscosity and curing kinetics of the epoxy-molding compound (emc). the wire sweep profile and pressure distribution around the wire region are presented. the numerical results of the flow front patterns and filled volume are compared with the previous experimental results and found in good conformity. therefore,the strength of mpcci code coupling in handling the fsi problems is proven to be excellent. © 2013 tibtd printed in turkey.