Effects of solvent evaporation on water sorption/solubility and nanoleakage of adhesive systems

Objective: to evaluate the influence of solvent evaporation in the kinetics of water diffusion (water sorption-ws,solubility-sl,and net water uptake) and nanoleakage of adhesive systems. material and methods:disk-shaped specimens (5.0 mm in diameter x 0.8 mm in thickness) were produced (n=48) using the adhesives: clearfil s3 bond (cs3)/kuraray,clearfil se bond control group (cse)/kuraray,optibond solo plus (os)/kerr and scotchbond universal adhesive (sbu)/3m espe. the solvents were either evaporated for 30 s or not evaporated (n=24/per group),and then photoactivated for 80 s (550 mw/cm2). after desiccation,the specimens were weighed and stored in distilled water (n=12) or mineral oil (n=12) to evaluate the water diffusion over a 7-day period. net water uptake (%) was also calculated as the sum of ws and sl. data were submitted to 3-way anova/tukey's test (α=5%). the nanoleakage expression in three additional specimens per group was also evaluated after ammoniacal silver impregnation after 7 days of water storage under sem. results: statistical analysis revealed that only the factor adhesive was significant (p<0.05). solvent evaporation had no influence in the ws and sl of the adhesives. cse (control) presented significantly lower net uptake (5.4%). the nanoleakage was enhanced by the presence of solvent in the adhesives. conclusions: although the evaporation has no effect in the kinetics of water diffusion,the nanoleakage expression of the adhesives tested increases when the solvents are not evaporated.