effect of cu content on structural properties of ni-cu @ a-c: h thin films

In this study, ni-cu nps @ a-c:h films withdifferent cu percentages, by co- depositionof rf-sputtering and rf- plasmaenhanced chemical vapor deposition (rfpecvd) were prepared using acetylene gasand ni and cu targets. the edax resultsshow that the ni and cu are presented inthe films successfully. with the increase ofcu percentages, the average diameter ofcnts was increased.