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synthesis and curing of thermoset bismaleimide resin based on epon 828 epoxy resin
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نویسنده
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jalilolghadr niri sara ,fattahi hassan ,mortezaei mehrzad
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منبع
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پانزدهمين همايش بين المللي علوم و فناوري پليمر - 1401 - دوره : 15 - پانزدهمین همایش بین المللی علوم و فناوری پلیمر - کد همایش: 01220-96957 - صفحه:0 -0
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چکیده
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In this study, a bismaleimide (bmi) was synthesized by reacting n-(4-hydroxyphenyl) maleimide (hpm) with diglycidyl ether of bisphenol a (dgeba). hpm was synthesized as an intermediate from maleic anhydride and aminophenol in the presence of triphenylphosphine (tpp) as catalyst. synthesized bmi had good processability with enhanced thermal stability in comparison with epoxy resin. the cure behavior of bmi was evaluated by differential scanning calorimetry (dsc) which showed the curing temperature at 259.3 °c.
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کلیدواژه
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epoxy-base bismaleimide ,synthesis ,curing ,thermoset
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آدرس
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, iran, , iran, , iran
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Authors
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