Analysis of Thermal and Flow Characteristics in a Combined Cross-Flow and Jet-Flow Configuration with Flow-Guiding Fins

This study investigated the enhanced cooling of electronic components at high temperatures with cross-flow and jet-flow combinations. the cooling performance of four different model geometries (models 1, 2, 3, and 4) of an electronic component was analysed by considering different jet-to-channel inlet velocity ratios (vj/vc) and ratios of the distance between the jet and impinging surface to jet diameter (h/d). the vj/vc and h/d ratios were varied in the 0–3 and 2–4 ranges, respectively, in the computational fluid dynamics analysis. the thermal and flow characteristics were revealed through a comparative result analysis, also considering results from the literature. the heat transfer improved, the nusselt number increased, and the electronic surface temperature decreased with an increase in the vj/vc ratio. however, the nusselt number decreased with an increase in the h/d ratio. models 2 and 4 had higher heat transfer from the electronic component than the other models. a low h/d ratio and low vj/vc ratio yielded higher heat transfer in model 3 than in model 1.