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effects of temperature on the wave soldering of printed circuit boards: cfd modeling approach
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نویسنده
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abdul aziz m. s. ,abdullah m. z. ,khor c. y. ,che ani f. ,adam n. h.
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منبع
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journal of applied fluid mechanics - 2016 - دوره : 9 - شماره : 4 - صفحه:2053 -2062
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چکیده
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This study investigated the effects of temperature on the wave soldering of printed circuit boards (pcbs) using three-dimensional finite volume analysis. a computational solder pot model consisting of a six-blade rotational propeller was developed and meshed using tetrahedral elements. the leaded molten solder (sn63pb37) distribution and pcb wetting profile were determined using the volume of fluid technique in the fluid flow solver, fluent. in this study, the effects of five different molten solder temperatures (456 k, 473 k, 523 k, 583 k, and 643 k) on the wave soldering of a 70 mm × 146 mm pcb were considered. the effects of temperature on wetting area, wetting profile, velocity vector, and full wetting time were likewise investigated. molten solder temperature significantly affected the wetting time and distribution of pcbs. the molten solder temperature at 523 k demonstrated desirable wetting distribution and yielded a stable fountain profile and was therefore considered the best temperature in this study. the simulation results were substantiated by the experimental results.
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کلیدواژه
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wave soldering; wetting area; volume of fluid (vof); finite volume method; printed circuit board (pcb)
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آدرس
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universiti sains malaysia, school of mechanical engineering, malaysia, universiti sains malaysia, school of mechanical engineering, malaysia, universiti malaysia perlis (unimap), uniciti alam campus, faculty of engineering technology (fetech), malaysia, universiti kebangsaan malaysia, institute of microengineering and nanoelectronics, malaysia. jabil circuit sdn. bhd., bayan lepas industrial park, malaysia, soil instruments (m) sdn bhd, malaysia
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پست الکترونیکی
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hana_adam85@yahoo.com
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Authors
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