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effects of aspect ratio in moulded packaging considering fluid/structure interaction: a cfd modelling approach
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نویسنده
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ishak m. h. h. ,abdullah m. z. ,abdul aziz m. s. ,abas a. ,loh w. k. ,ooi r. c. ,ooi c. k.
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منبع
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journal of applied fluid mechanics - 2017 - دوره : 10 - شماره : 6 - صفحه:1799 -1811
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چکیده
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The fluid/structure interaction (fsi) investigations of stacked chip in encapsulation process of moulded underfill packaging using the twoway coupling method with ansys fluent and ansys structural solvers are presented. the fsi study is executed with different aspect ratio of stacked chip on the mould filling during the encapsulation process. the simulation results in the fsi study is well validated with experimental setup. the epoxy moulding compound (emc) and structure (chip) interaction is analyzed for better understanding the fsi phenomenon.von mises stresses experienced by the chip also be monitored for risk of chip cracking. the proposed analysis is anticipated to be a recommendation in the chip design and improvement of 3d integration packages.
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کلیدواژه
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air void ,deformation ,moulded packaging ,stacked chip ,aspect ratio.
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آدرس
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universiti sains malaysia, engineering campus, school of mechanical engineering, malaysia, universiti sains malaysia, engineering campus, school of aerospace engineering, malaysia, universiti sains malaysia, engineering campus, school of mechanical engineering, malaysia, universiti sains malaysia, engineering campus, school of mechanical engineering, malaysia
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پست الکترونیکی
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ooi@intel.com
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Authors
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