Effect of accumulative roll bonding (ARB) process on the electrochemical behavior of pure copper in 0.01 M KOH solution

In this work,effect of accumulative roll bonding (arb) process on the electrochemical behavior of pure copper in 0.01 m koh solution were studied. corrosion current density measured from potentiodynamic polarization plots,the passive film and charge-transfer resistance estimated with electrochemical impedance spectroscopy (eis) and finally defect density drawn from mott–schottky analysis. potentiodynamic polarization curves revealed that the higher number of cycles for specimens proceeds with the arb process rather than annealing yield to lower corrosion current density. eis results showed that as the number of arb cycles increases,both passive film and the charge-transfer resistance increases. mott–schottky analysis revealed that with increasing the number of arb cycles,the acceptor density of the passive films decreased. all electrochemical measurements showed that increasing the number of arb cycles offer better conditions for forming the passive films. © 2015 the authors.