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Factors identification on optimization of ball placement tool for flip-chip- ball-grid-array product
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نویسنده
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ismail a. ,dolah r. ,miyagi z.
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منبع
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jurnal teknologi - 2016 - دوره : 78 - شماره : 1 - صفحه:175 -179
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چکیده
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Market demand on system-on-chip (soc) using ball-attach technologies,it is time for ball-attach module to have an improvement on their capabilities within limited resources (man and machine). this paper identifies caused of factor which contributes more time to production time. justification on improving ball-attach module cycle time during high volume activities is explained. © 2016 penerbit utm press. all rights reserved.
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کلیدواژه
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Ball-attach; Equipment optimization; Product conversion
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آدرس
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utm razak school of engineering and advance technology,universiti teknologi malaysia,jalan semarak,kuala lumpur, Malaysia, utm razak school of engineering and advance technology,universiti teknologi malaysia,jalan semarak,kuala lumpur, Malaysia, department of mechanical engineering,meiji university,1-1-1 higashi-mita,tama-ku,kawasaki-shi,kanagawa-ken, Japan
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Authors
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