thermo-mechanical analysis of wire drawing of copper with pcd die: fem study

Thermo-mechanical finite element simulation was used to study copper wire drawing with pcd die. effect of drawing angle and coefficient of friction on the distribution of stress and strain on the surface of die and cross-section of wire studied, respectively. elasto-viscoplastic and elastic models were used to simulate copper and pcd behavior in the axisymmetric model. regardless of the amount of the drawing angle and coefficient of friction, die entrance and exit exhibit the highest stress on the surface of the die. maximum amounts of temperature were observed on the surface of the wire exiting the deformation zone. according to the profile of pressure and temperature, the die nib bears the highest amount of pressure and temperature on the die and is susceptible to wear. analyzing the strain on the wire and stress on the surface of the die showed that at high drawing angles, the distribution of strain on the wire becomes uneven, also stress on the die nib will increase. in contrast, at low drawing angles, the temperature and drawing force rise because of the increase in friction effect. choosing the drawing angle based on the optimization of the drawing force keeps all mentioned parameters in an acceptable range.