Effect of Silver Interlayer on Transient Liquid Phase (Tlp) Bonding of Al 2024 To Ti-6al-4v Joints

Transient liquid phase (tlp) bonding of two dissimilar alloys al 2024 and ti_6al_4 was carried out at 580 and 600 °c for 45 min bonding time using a 30-µm-thick pure silver (ag) foil interlayer. scanning electron microscopy (sem) and x-ray diffraction (xrd) were used to investigate the phase structure and compositional changes across the joint region. mechanical properties of the joints were investigated through shear strength and hardness tests. the joint formation was due to the solid-state diffusion of ag and cu into al and ti alloys, followed by eutectic formation, isothermal solidification, and formation of various intermetallic compounds such as ag_2al, al_2cu and al_2cumg along the ag/al_2o_4 interface. moreover, the interdiffusion of titanium and aluminum led to the formation of al_3ti intermetallic compounds. these types of intermetallics produced a metallurgical bond at al 2024 interface. the study showed that the shear strength of the joint reaches a high value of 176.11 mpa obtained at the higher bonding temperature of 600 °c. it was also observed that the sample failed away from the base metal.