numerical study of flattened miniature heat pipe with hybrid porous wick and double heat sources

Designing flattened miniature heat pipes (fmhps) for electronic devices is a challenging issue due to high heat flux and limited heat dissipation space. it requires understanding the combined effects of the sintered-grooved wick structure, double heat sources, and flat thickness on heat pipes’ thermal efficiency. therefore, the aim of this study is to numerically investigate the effects of the fmhp with a hybrid wick on the thermal performance of its double heat sources acting as the cpu and gpu in notebook pcs. a transient 3d finite volume method was used to solve the governing equations and assisted boundary conditions. the cylindrical heat pipe with a 200 mm length and 6 mm outside diameter is flattened into 2, 2.5, 3, and 4 mm final thicknesses (ft). the obtained results show that the final critical thicknesses with the lowest thermal resistance are 2.5 and 3 mm for hybrid and grooved wick structures, respectively. therefore, fmhp with hybrid wicks can be flattened about 8% more. hybrid wick structures have the best effect on fmhp thermal performance at ft=2.5 mm