Multi-Scale Modeling For Thermal Conductivity Analysis of Epoxy Nanocomposite - Cnt

Hierarchical multi-scale modeling was used in the paper to investigate the contact area between the nanoparticle component and the surrounding environment. the modeling of the nanoparticle component and the interface region was designed using molecular dynamics. first, the desired thermal properties were obtained at the nanoscale, and then the obtained results were used at a larger longitudinal scale in a numerical solution by finite element method. finally, by numerical homogenization, the optimal thermal properties were calculated, and the obtained results were compared with the existing experimental results. the effect of other influential parameters such as volume ratio, aspect ratio (length to diameter ratio), particle alignment on the interface region and the optimal thermal properties of the nanocomposite were also investigated. three-dimensional cntnanocomposite epoxy samples were investigated in this study. the overall thermal conductivity was evaluated by obtaining the interfacial thermal conductivity between the nanoparticle component and the surrounding environment (resin) and then changing the influential parameters. relevant thermal properties and behavior of rve and analysis of the results in all scales have been reviewed. significant cases of curing and simulation of epoxy bonding and related hardener have been considered in the molecular dynamics modeling of nanocomposites.