Converting non-metallic printed circuit boards waste into a value added product

The aim of this study was to investigate the feasibility of using nonmetallic printed circuit board (pcb) waste as fillerin recycled hdpe (rhdpe) in production of rhdpe/pcb composites. maleic anhydride modified linear low-densitypolyethylene (mape) was used as compatibilizer. in particular, the effects of nonmetallic pcb and mape onmechanical properties of the composites were assessed through tensile, flexural and impact testing. scanningelectron microscope (sem) was used to study the dispersion of nonmetallic pcb and mape in the matrix.nonmetallic pcb was blended with rhdpe from 0–30 wt% and prepared by counter-rotating twin screw extruderfollowed by molding into test samples via hot press for analysis. a good balance between stiffness, strength andtoughness was achieved for the system containing 30 wt% pcb. thus, this system was chosen in order toinvestigate the effect of the compatibilizer on the mechanical properties of the composites. the results indicatethat mape as a compatiblizer can effectively promote the interfacial adhesion between nonmetallic pcb and rhdpe.the addition of 6 phr mape increased the flexural strength, tensile strength and impact strength by 71%, 98% and44% respectively compared to the uncompatibilized composites.